Via Specification
Via always used for conductive, heat dissipation, signal transmission and test, according to different product and different requirement in the function of the via, there have 3 different kinds of process methods for the via in production.
Items | Performance form | Application |
Cover the vias with solder mask | The vias have not be opened on the solder mask layer in the gerber file, and when we cover the board with solder mask, there will have some solder mask oil flow into the via and the via will be covered by solder mask finally. | Suitable for the via which only use for conductive and no any other special requirement. |
Open the vias on solder mask | The vias have been opened on the solder mask layer in the gerber file, and when we cover the board with solder mask, the solder mask will shy away from the vias and will expose the copper of the vias. | Suitable for the via which need have good heat dissipation or use for test. |
Plugged via/via-in-pad | The via with a solder pad above it in the gerber file. And the via will full fill with solder mask oil or resin before we cover the board with solder mask. | Suitable for the design which need to put some pads above the via and use for soldering. |
1. Cover the vias with solder mask
2. Open the vias on solder mask
3. Plugged via/via-in-pad