High Temperature Resistance Capacity
Thermal shock refers to the process of large amount of heat exchange caused by an object in a short period of time due to
rapid heating or cooling. When the temperature changes drastically, the object will generate impact thermal stress. This phenome
non is called thermal shock. If the thermal stresses that exceed the affordability of the material, it will damage the metal parts.
In IPC-6160, the standard of the thermal shock capacity of base material, semi-finished and finished PCB is that under 288℃
condition, 10 seconds, for three times , the structural of the PCB will not damage(like bubble, delamination, textured appearance)
and the plating on the board surface, solder resist, and text will not peeled off
Base on the stipulate of the quality in IPC-6160, OSpcb have built four fix- test points sampling on the process to test the
high temperature resistance capacity of the PCB.
PCB thermal shock test are used for testing the physical performance of the PCB,include high temperature resistance capacity、
anti-aging capacity、environmental adaptability、function stability……